Shenzhen International Semiconductor & IC Exhibition (SEMI-e 2025) ran 10–12 September 2025 at Shenzhen World Exhibition & Convention Center. Super-hard materials are a vital link in the semiconductor chain; as one of the world’s best-known diamond-tool suppliers, Monte-Bianco showcased an integrated & innovative “equipment + tools + process” trinity solution that gives semiconductor customers ultra-precise, high-efficiency material-processing support.


Monte-Bianco spotlighted four flagship product lines: double-side lapping & polishing machines, precision diamond tools, lapping & polishing consumables, and functional diamond materials—demonstrating end-to-end strength in semiconductor processing and innovation.


1. Double-side lapping & polishing machine
Handles piezo-crystals, compound semiconductors, Si wafers, optical (microcrystaline) glass, ceramic plates, window glass, metals and sapphire. Supports 2.5 D/3 D curved polishing to meet semiconductor’s toughest precision demands. Live demos let visitors experience its power and performance first-hand.

2. Precision diamond tools
Metal-, ceramic-, resin-bonded and electroplated cutting, drilling and grinding tools for substrates, wafers, optical glass, precision-ceramic parts and 3C electronics. On-show diamond thinning wheels, chamfering wheels and ultra-thin wheels drew considerable interest and enquiries.

3. Precision lapping & polishing consumables

Engineered for optical glass, sapphire, silicon and SiC wafers; material & process innovations deliver ultra-precision finishes that guarantee reliable surface quality for device fabrication.


4. Functional diamond materials
BDD diamond-film electrodes, Au-plated diamond heat spreaders, free-standing CVD diamond heat spreaders and diamond-copper composites show broad promise in electrochemical water treatment and chip thermal management—highlighting diamond’s multi-role value in semiconductors. In particular, the free-standing CVD diamond heat-spreader, only ~600 µm thick and readily diced into custom shapes, offers an innovative route to chip-level thermal management.


Monte-Bianco’s booth attracted global experts and supply-chain partners. Our engineers exchanged insights on processing trends and offered tailor-made solutions for each customer.

Every exhibition is a chance to learn and grow, helping us align with global trends. Going forward, Monte-Bianco will keep deepening its “equipment + tools + process” trinity solution, delivering ever-better products and services, and working with partners to advance materials science for a better life.