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-- For Precise Machining Tools
Grindind wheels For Ceramic Encapsulation Materials
- Overview
- Specifications
- Features
Grindind wheels For Ceramic Encapsulation Materials
Mainly used for surface and cylindrical grinding of ceramic packaging materials for electronic components,such as corundum or silicon carbide,also for surface and cylindrical grinding of hard alloy.
*High grinding efficiency
*Good surface finish quality
*Long service life
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